Borosilicate Glass Wafer
Low-expansion glass wafers suited to anodic bonding with silicon, polished to optical quality.
Thermal expansion close to silicon makes borosilicate glass the usual choice for glass-to-silicon bonding. Drilling and patterning can be added before delivery.
Specifications
| Parameter | Value |
|---|---|
| Diameter | 2" – 8", square formats on request |
| Thickness | 100 µm – 2 mm |
| Surface roughness | Ra < 1 nm (polished) |
| Options | Through-holes, cavities, dicing |
Applications
- Anodic bonding caps for MEMS
- Microfluidic and lab-on-chip devices
- Wafer-level packaging carriers